Data Communication & Storage

Driven by the rapid growth of AI infrastructure, cloud computing, and high-speed data transmission, demand for high-performance connector components continues to increase across data centers, servers, storage systems, switches, and optical communication equipment. Polygon supports leading customers with high-precision molded, stamped, and insert-molded components for next-generation high-speed interconnect applications.

Applications Served

Polygon specializes in high-precision molded, stamped, and insert-molded components for AI servers, data centers, high-speed connectors, data storage systems, optical communication modules, switches, and signal transmission applications.

High-Speed Connector Applications

* OSFP / OSFP-XD
* QSFP-DD
* High-speed backplane connectors
* Board-to-board connectors
* Power connectors

Telecommunication Base Stations

* RRU modules
* BBU modules
* Base station equipment

AI Data Centers & Servers

* AI servers
* Data centers
* Storage systems
* Switches
* Optical communication modules
* DDR / memory-related components
* Signal transmission modules